thick-film process

基本解释

Thin-or thick-film circuits comprising passive and active elements obtained during the same technological process are to be classified in heading 85.42.
用同样工艺制得的无源元件及有源元件组成的薄膜电路或厚膜电路应归入品目85。
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This pa-per introduces thick film assembling technique, equipment, technical parameters and testing methods while narrating the manufacturing process of thick film circuits.
在叙述点火模块厚膜电路的生产过程中系统介绍了厚膜封装工艺、相关设备、技术参数和检测方法。
The lithography of thick film resist is a complex non-linear process. Dissolution rate of resist is mainly affected by distribution of PAC concentration in thick film resist.
厚胶光刻过程是一个复杂的非线性过程，其光刻胶内光敏化合物（PAC）浓度空间分布是影响显影面形的主要因素。