flip-chip
基本解释
- 倒装法,倒装芯片
英汉例句
- Flip Chip technology is a typical application.
倒装芯片技术就是其中一个典型应用。 - As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。 - A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants.
关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。 - The current crowding effect and temperature distributions in flip chip solders are discussed.
本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。 - Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC.
采用通用有限元软件MSC.
词组短语
- flip -chip bonder [电子]倒装焊接器
- Flip -chip Substrates 倒装芯片基片
- FLIP -CHIP MOUNTER 全自动高速倒装机
短语
专业释义
- 后滚翻
- 芯片反转